MXIC Serial/Parallel Flash 系列产品特点:
•体积小— 由于串行flash采用比并行flash更少的连线在一个系统中传送数据,所以缩小的系统板的空间,能常采用SOIC8、DFN、BGA等封装;
•低功耗 — 串行SPI FLASH器件采用串行接口进行连续数据存取,所以可以达到工作电流:7mA 待机电流:8uA;
•工作温度范围宽 - 最新的Q版本工作温度在-40 to +105;
•快速擦除烧录程式 —通过4KByte统一Sector-Erase,32Kbyte或者64Kbyte Block-Erase或者Chip- Erase能力,目前已达到数据擦除:18mS;
•成本低,用途广 - 由于是台湾生产与加工,无形中降低了很多成本。广泛应用于数码类以及消费类电子产品中;
•产品线长 - 串行SPI FLASH产品提供512Kb - 128Mb的密度、I2C、Microwire 和 SPI 兼容协议。
MXIC Serial Flash系列规格参数 | |||||
Part No. | Density | Voltage | Temp Range | Max Freq(MHz) | Package(s) |
MX25L5121E | 512Kb | 3V | -40°C to +85°C | 45 | SOIC8(150mil) TSSOP8(173mil) USON8(2*3mm) |
MX25V512 | 512Kb | 2.5V | -40°C to +85°C | 50 | USON8(2*3mm) |
MX25V512C | 512Kb | 2.5V | -40°C to +85°C | 50 | TSSOP8(173mil) USON8(2*3mm) |
MX25V512E | 512Kb | 2.5V | -40°C to +85°C | 75(x1) 70(x2) | TSSOP8(173mil) USON8(2*3mm) |
MX25L1006E | 1Mb | 3V | -40°C to +85°C | 104(x1) 80(x2) | SOIC8(150mil) USON8(2*3mm) |
MX25L1021E | 1Mb | 3V | -40°C to +85°C | 45 | SOIC8(150mil) |
MX25L1025C | 1Mb | 3V | -40°C to +85°C | 85 | SOIC8(150mil) |
MX25L1026E | 1Mb | 3V | -40°C to +85°C | 104(x1) 80(x2) | SOIC8(150mil) |
MX25V1006E | 1Mb | 2.5V | -40°C to +85°C | 75(x1) 70(x2) | TSSOP8(173mil) USON8(2*3mm) |
MX25L2005 | 2Mb | 3V | -40°C to +85°C | 85 | SOIC8(150mil) WSON8(6*5mm) |
MX25L2006E | 2Mb | 3V | -40°C to +85°C | 86(x1) 80(x2) | SOIC8(150mil) WSON8(6*5mm) USON8(2*3mm) |
MX25L2026C | 2Mb | 3V | -40°C to +85°C | 85 | SOIC8(150mil) |
MX25L2026E | 2Mb | 3V | -40°C to +85°C | 86(x1) 80(x2) | SOIC8(150mil) |
MX25U2033E | 2Mb | 1.8V | -40°C to +85°C | 80(x1, x2) 70(x4) | SOIC8(150mil) WSON8(6*5mm) USON8(4*4mm) |
MX25V2006E | 2Mb | 2.5V | -40°C to +85°C | 75(x1) 70(x2) | SOIC8(150mil) WSON8(6*5mm) |
MX25L4006E | 4Mb | 3V | -40°C to +85°C | 86(x1) 80(x2) | SOIC8(150mil) SOIC8(200mil) WSON8(6*5mm) USON8(2*3mm) PDIP8(300mil) |
MX25L4026E | 4Mb | 3V | -40°C to +85°C | 86(x1) 80(x2) | SOIC8(150mil) |
MX25U4033E | 4Mb | 1.8V | -40°C to +85°C | 80(x1, x2) 70(x4) | SOIC8(150mil) WSON8(6*5mm) USON8(4*4mm) |
MX25U4035 | 4Mb | 1.8V | -40°C to +85°C | 40(x1, x2) 33(x4) | SOIC8(150mil) WSON8(6*5mm) USON8(4*4mm) |
MX25V4006E | 4Mb | 2.5V | -40°C to +85°C | 75(x1) 70(x2) | SOIC8(150mil) WSON8(6*5mm) |
MX25V4035 | 4Mb | 2.5V | -40°C to +85°C | 66(x1) 50(x2, x4) | SOIC8(150mil) WSON8(6*5mm) |
MX25L8006E | 8Mb | 3V | -40°C to +85°C | 86(x1) 80(x2) | SOIC8(150mil) SOIC8(200mil) WSON8(6*5mm) USON8(2*3mm) PDIP8(300mil) |
MX25L8035E | 8Mb | 3V | -40°C to +85°C | 108(x1, x4) 80(x2) | SOIC8(200mil) |
MX25L8036E | 8Mb | 3V | -40°C to +85°C | 133(x1, x2, x4) | SOIC8(200mil) |
MX25U8033E | 8Mb | 1.8V | -40°C to +85°C | 80(x1, x2) 70(x4) | SOIC8(150mil) SOIC8(200mil) WSON8(6*5mm) USON8(2*3mm) |
MX25U8035 | 8Mb | 1.8V | -40°C to +85°C | 40(x1, x2) 33(x4) | SOIC8(150mil) WSON8(6*5mm) USON8(2*3mm) |
MX25U8035E | 8Mb | 1.8V | -40°C to +85°C | 104(x1, x4) 84(x2) | SOIC8(150mil) SOIC8(200mil) WSON8(6*5mm) USON8(2*3mm) |
MX25V8006E | 8Mb | 2.5V | -40°C to +85°C | 75(x1) 70(x2) | SOIC8(150mil) WSON8(6*5mm) |
MX25V8035 | 8Mb | 2.5V | -40°C to +85°C | 66(x1) 50(x2, x4) | SOIC8(150mil) WSON8(6*5mm) |
MX25L1606E | 16Mb | 3V | -40°C to +85°C | 86(x1) 80(x2) | SOIC8(150mil) SOIC8(200mil) SOIC8(300mil) PDIP8(300mil) USON8(2*3mm) WSON8(6*5mm) TFBGA24(6*8mm) |
MX25L1633E | 16Mb | 3V | -40°C to +85°C | 104(x1) 85(x2, x4) | SOIC8(200mil) WSON8(6*5mm) |
MX25L1635E | 16Mb | 3V | -40°C to +85°C | 108(x1, x4) 80(x2) | SOIC8(200mil) |
MX25L1636D | 16Mb | 3V | -40°C to +85°C | 86(x1) 75(x2, x4) | SOIC8(200mil) SOIC16(300mil) |
MX25L1636E | 16Mb | 3V | -40°C to +85°C | 133(x1, x2, x4) | SOIC8(200mil) |
MX25U1635E | 16Mb | 1.8V | -40°C to +85°C | 104(x1,x4) 84(x2) | SOIC8(150mil) SOIC8(200mil) WSON8(6*5mm) USON8(2*3mm) |
MX25L3206E | 32Mb | 3V | -40°C to +85°C | 86(x1) 80(x2) | SOIC8(150mil) SOIC8(200mil) SOIC8(300mil) PDIP8(300mil) USON8(2*3mm) WSON8(6*5mm) TFBGA24(6*8mm) |
MX25L3225D | 32Mb | 3V | -40°C to +85°C | 104(x1) 75(x2, x4) | SOIC8(200mil) |
MX25L3235D | 32Mb | 3V | -40°C to +85°C | 104(x1) 75(x2, x4) | SOIC8(200mil) SOIC16(300mil) WSON8(8*6mm) WSON8(6*5mm) |
MX25L3235E | 32Mb | 3V | -40°C to +85°C | 104(x1, x4) 86(x2) | SOIC8(200mil) SOIC16(300mil) WSON8(6*5mm) |
MX25L3236D | 32Mb | 3V | -40°C to +85°C | 86(x1) 75(x2, x4) | SOIC8(200mil) |
MX25L3237D | 32Mb | 3V | -40°C to +85°C | 86(x1) 75(x2, x4) | SOIC16(300mil) WSON8(6*5mm) |
MX25U3235E | 32Mb | 1.8V | -40°C to +85°C | 104(x1, x4) 84(x2) | SOIC8(200mil) WSON8(6*5mm) |
MX25U3235F | 32Mb | 1.8V | -40°C to +85°C | 104(x1, x4) 84(x2) | SOIC8(200mil) WSON8(6*5mm) |
MX25L6406E | 64Mb | 3V | -40°C to +85°C | 86(x1) 80(x2) | SOIC8(200mil) SOIC16(300mil) WSON8(8*6mm) TFBGA24(6*8mm) |
MX25L6435E | 64Mb | 3V | -40°C to +85°C | 104(x1, x4) 86(x2) | SOIC8(200mil) SOIC16(300mil) WSON8(8*6mm) |
MX25L6436E | 64Mb | 3V | -40°C to +85°C | 104(x1) 70(x2, x4) | SOIC8(200mil) SOIC16(300mil) WSON8(8*6mm) |
MX25L6445E | 64Mb | 3V | -40°C to +85°C | 104(x1) 70(x2, x4) | SOIC8(200mil) SOIC16(300mil) WSON8(8*6mm) |
MX25L6465E | 64Mb | 3V | -40°C to +85°C | 104(x1) 70(x2, x4) | SOIC8(200mil) SOIC16(300mil) WSON8(8*6mm) |
MX25U6435E | 64Mb | 1.8V | -40°C to +85°C | 104(x1, x4) 84(x2) | WSON8(6*5mm) |
MX25U6435F | 64Mb | 1.8V | -40°C to +85°C | 104(x1, x4) 84(x2) | SOIC8(200mil) WSON8(6*5mm) |
MX25L12835E | 128Mb | 3V | -40°C to +85°C | 104(x1) 70(x2, x4) | SOIC16(300mil) WSON8(8*6mm) |
MX25L12836E | 128Mb | 3V | -40°C to +85°C | 104(x1) 70(x2, x4) | SOIC16(300mil) WSON8(8*6mm) |
MX25L12845E | 128Mb | 3V | -40°C to +85°C | 104(x1) 70(x2, x4) | SOIC16(300mil) WSON8(8*6mm) |
MX25L12865E | 128Mb | 3V | -40°C to +85°C | 104(x1) 70(x2, x4) | SOIC16(300mil) WSON8(8*6mm) |
MX25U12835F | 128Mb | 1.8V | -40°C to +85°C | 104(x1, x4) 84(x2) | SOIC16(300mil) WSON8(6*5mm) WSON8(8*6mm) |
MX25L25635E | 256Mb | 3V | -40°C to +85°C | 80(x1) 70(x2, x4) | SOIC16(300mil) WSON8(8*6mm) |
MX25L25635F | 256Mb | 3V | -40°C to +85°C | 133(x1, x2, x4) | SOIC16(300mil) WSON8(8*6mm) |
MX25L25735E | 256Mb | 3V | -40°C to +85°C | 80(x1) 70(x2, x4) | SOIC16(300mil) WSON8(8*6mm) |
MX25L25835E | 256Mb | 3V | -40°C to +85°C | 104(x1) 70(x2, x4) | SOIC16(300mil) |
MXIC Parallel Flash系列规格参数 | |||||
Part No. | Density | Voltage | Temp Range | Speed(ns) | Package(s) |
MX29F200C T/B | 2Mb | 5V | -40°C to +85°C | 70 | TSOP-48 |
MX29F040C | 4Mb | 5V | -40°C to +85°C | 70 | TSOP-32 PLCC-32 |
MX29F400C T/B | 4Mb | 5V | -40°C to +85°C | 70 | SOP-44 TSOP-48 |
MX29LV004C T/B | 4Mb | 3V | -40°C to +85°C | 70 | PLCC-32 |
MX29LV040C | 4Mb | 3V | -40°C to +85°C | 70 | TSOP-32 PLCC-32 |
MX29LV400C T/B | 4Mb | 3V | -40°C to +85°C | 70 | SOP-44 LFBGA-48 TFBGA-48 TSOP-48 WFBGA-48 XFLGA-48 |
MX29SL402C T/B | 4Mb | 1.8V | -40°C to +85°C | 90 | TSOP-48 TFBGA-48 LFBGA-48 WFBGA-48 XFLGA-48 |
MX29F800C T/B | 8Mb | 5V | -40°C to +85°C | 70 | SOP-44 TSOP-48 FBGA-48 |
MX29LV800C T/B | 8Mb | 3V | -40°C to +85°C | 70 | SOP-44 TSOP-48 TFBGA-48 LFBGA-48 WFBGA-48 XFLGA-48 |
MX29LV160D T/B | 16Mb | 3V | -40°C to +85°C | 70 | TSOP-48 TFBGA-48 WFBGA-48 XFLGA-48 LFBGA-48 |
MX29LV161D T/B | 16Mb | 3V, (VI/O) | -40°C to +85°C | 90 | TSOP-48 TFBGA-48 WFBGA-48 XFLGA-48 LFBGA-48 |
MX29GL320E H/L | 32Mb | 3V | -40°C to +85°C | 70 | TSOP-56 LFBGA-64 |
MX29GL320E T/B | 32Mb | 3V | -40°C to +85°C | 70 | TSOP-48 FBGA-48 |
MX29LV320E T/B | 32Mb | 3V | -40°C to +85°C | 70 | SOP-44 TSOP-48 LFBGA-48 TFBGA-48 |
MX29LV321D T/B | 32Mb | 3V | -40°C to +85°C | 90 | TSOP-48 TFBGA-48 |
MX29GL640E H/L | 64Mb | 3V | -40°C to +85°C | 70 | TSOP-56 LFBGA-64 |
MX29GL640E T/B | 64Mb | 3V | -40°C to +85°C | 70 | TSOP-48 LFBGA-48 |
MX29LV640E T/B | 64Mb | 3V | -40°C to +85°C | 70 | TSOP-48 TFBGA-48 |
MX29GL128E | 128Mb | 3V (VI/O) | -40°C to +85°C | 90 | TSOP-56 FBGA-64 LFBGA-64 SSOP-70 |
MX29GL128F H/L | 128Mb | 3V (VI/O) | -40°C to +85°C | 70 | FBGA-56 TSOP-56 LFBGA-64 |
MX29GL128F H/L | 128Mb | 3V | -40°C to +85°C | 90 | SSOP-70 |
MX29GL256E | 256Mb | 3V (VI/O) | -40°C to +85°C | 90 | TSOP-56 FBGA-64 LFBGA-64 SSOP-70 |
MX29GL256F H/L | 256Mb | 3V (VI/O) | -40°C to +85°C | 90 | FBGA-56 TSOP-56 LFBGA-64 |
MX29GL256F H/L | 256Mb | 3V | -40°C to +85°C | 90 | SSOP-70 |
MX29GL512E H/L | 512Mb | 3V | -40°C to +85°C | 100 | TSOP-56 LFBGA-64 SSOP-70 |
MX29GL512F H/L | 512Mb | 3V | -40°C to +85°C | 100 | TSOP-56 LFBGA-64 |
MX29GL512F H/L | 512Mb | 3V | -40°C to +85°C | 100 | SSOP-70 |
MX68GL1G0F H/L | 1Gb | 3V | -40°C to +85°C | 110 | TSOP-56 LFBGA-64 |
MX68GL1G0F H/L | 1Gb | 3V | -40°C to +85°C | 110 | SSOP-70 |
深圳市昊海鑫科技有限公司
电话:0755-33561021 传真:0755-85298357
联系人:陈先生 手机:186-7636-7856 QQ:1289315967
为了让尊贵的您相信我们昊海鑫科技所提供的【MXIC旺宏微半导体】IC系列均为原装正品,我们特作出如下零风险承诺:
1、昊海鑫科技保证提供的所有产品均为原厂全新正品,假一赔十;
2、昊海鑫科技所提供的所有产品符合行业技术标准和质量检测标准,符合原厂苛刻的相关技术指标;
3、若产品存在任何质量问题,本公司无条件负责退货、退款或换货,查明问题原因并赔偿由于我们的疏忽给贵司带来的一切损失。
如需订购,请拔打全国服务热线:137-137-40018
首页产品中心代理品牌IC学院 IC资讯成功案例常见问题了解昊海鑫 企业新闻联系我们企业招聘
Copyright © 2005-2010 All rights reserved 深圳市昊海鑫科技有限公司 粤ICP备18143393号CNZZ()
地址:广东省深圳市宝安区西乡街道固戍社区宝源路北侧宝港中心411电话:0755-33561021
传真:0755-85298357邮箱:haixinkeji@163.com技术支持:昊海鑫科技
深圳最专业的IC代理商,IC供应商,TPOWER代理商,英集芯代理商,3PEAK代理商,帝奥微代理商,纳芯微代理商,EON代理商,Winbond代理商.你身边最优秀的IC供应商合作伙伴
升邦科技官方微信
扫一扫立即加关注