Winbond SDRAM/DDR 系列产品特点:
•高速度— 1600Mbps的DDR3能迎合需要高速效的数码电视、STB、蓝光播放机和网络设备;
•低功耗 —DDR3(1.5V) 的电压比DDR2(1.8V)低,能减低系统的耗电量;
•工作温度范围宽 - 最新的Q版本工作温度在-40 to +105;
•高品质 - 由于是国内生产与加工,无形中降低了很多成本。广泛应用于数码类以及消费类电子产品中;
•产线长 - Winbond已拥有全系列的DRAM产品。其中以TSOP-II和FBGA封装的128Mb~256Mb SDRAM、128Mb~512Mb DDR。
Winbond SDRAM系列规格参数 | ||||||
Part No. | Density | Organization | Speed Grade | Max Freq | Voltage | Package |
W9816G6IB | 16M | 1Mx16 | -6 | 166 MHz | 3.3V±0.3V | Packaged in VFBGA 60 balls pitch=0.65mm, using Lead free materials with RoHS compliant |
-7 | 143 MHz | 2.7V~3.6V | ||||
W9816G6IH | 16M | 1Mx16 | -5 | 143 MHz | 3.3V±0.3V | Package in 50-pin, 400 mil TSOP II, using Lead free materials with RoHS compliant |
200 MHz | ||||||
-6/-6I/-6A | 166 MHz | 3.3V±0.3V | ||||
-7/-7I | 143 MHz | 2.7V~3.6V | ||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. | ||||||
Part No. | Density | Organization | Speed Grade | Max Freq | Voltage | Package |
W9864G2IH | 64M | 2Mx32 | -5 | 200 MHz | 3.3V±0.3V | Packaged in TSOP II 86-pin, using Lead free materials with RoHS compliant |
-6/-6I/-6A | 166 MHz | |||||
-7 | 143 MHz | 2.7V~3.6V | ||||
W9864G6IH | 64M | 4Mx16 | -5 | 200 MHz | 3.3V±0.3V | Packaged in TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant |
-6/-6I/-6A | 166 MHz | |||||
-7/-7S | 143 MHz | 2.7V~3.6V | ||||
W9864G6JH | 64M | 4Mx16 | -5 | 200 MHz | 3.3V±0.3V | Packaged in TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant |
-6/-6I | 166 MHz | |||||
-7/-7S | 143 MHz | 2.7V~3.6V | ||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life, N= None for new design. | ||||||
Part No. | Density | Organization | Speed Grade | Max Freq | Voltage | Package |
W9812G2IH | 128M | 4Mx32 | -6C | 166 MHz | 3.3V±0.3V | Packaged in TSOP II 86-pin, using Lead free materials with RoHS compliant |
-6/-6I/-6A | 2.7V~3.6V | |||||
-75 | 133 MHz | |||||
W9812G2IB | 128M | 4Mx32 | -6/-6I/-6A | 166 MHz | 2.7V~3.6V | Packaged in TFBGA 90 Ball(8x13mm2 ), using Lead free materials with RoHS compliant |
-75 | 133 MHz | |||||
W9812G6IH | 128M | 8Mx16 | -5 | 200 MHz | 3.3V±0.3V | TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant |
-6/-6C/-6I/-6A | 166 MHz | |||||
-75 | 133 MHz | |||||
W9812G6JH | 128M | 8Mx16 | -5 | 200 MHz | 3.3V±0.3V | TSOP II 54-pin, 400 mil using Lead free with RoHS compliant |
-6/-6I | 166 MHz | |||||
-75 | 133 MHz | |||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. | ||||||
Part No. | Density | Organization | Speed Grade | Max Freq | Voltage | Package |
W9825G2DB | 256M | 8Mx32 | -6 | 166 MHz | 3.3V±0.3V | TFBGA 90 ball using Pb free with RoHS compliant |
-6I | 2.7V~3.6V | |||||
-75/75I | 133 MHz | |||||
W9825G6EH | 256M | 16Mx16 | -5 | 200MHz | 3.3V±0.3V | Packaged in TSOP II 54-pin, 400 mil - 0.80, using Lead free materials with RoHS compliant |
-6/-6I/-6A | 166 MHz | |||||
-6 | 133 MHz | |||||
-75/75I/75A | ||||||
W9825G6JH | 256M | 16Mx16 | -5 | 200MHz | 3.3V±0.3V | Packaged in TSOP II 54-pin, 400 mil - 0.80, using Lead free materials with RoHS compliant |
-6/-6I | 166 MHz | |||||
-6 | 133 MHz | |||||
-75 | ||||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. | ||||||
Winbond DDR/DDR1系列规格参数 | ||||||
Part No. | Density | Organization | Speed Grade | |||
W9464G6IH | 64Mb DDR | 4Mx16 | 4 Banks | -4 | 250 MHz | CL3/CL4 |
-5/-5I | 200 MHz | CL3 | ||||
-6/-6I | 166 MHz | CL2.5 | ||||
W9464G6JH | 64Mb DDR | 4Mx16 | 4 Banks | -4 | 250 MHz | CL3/CL4 |
-5 | 200 MHz | CL3 | ||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life, N=Not recommended for new design. | ||||||
Part No. | Density | Organization | Speed Grade | |||
W9412G6IH | 128Mb DDR | 8Mx16 | 4 Banks | -4 | 250 MHz | CL3/CL4 |
-5/-5I | 200 MHz | CL3 | ||||
-6/-6I | 166 MHz | CL2.5 | ||||
W9412G6JH | 128Mb DDR | 8Mx16 | 4 Banks | -4 | 250 MHz | CL3/CL4 |
-5 | 200 MHz | CL3 | ||||
W9412G2IB | 128Mb DDR | 4Mx32 | 4 Banks | -4 | 250 MHz | CL3/CL4 |
-5/-5I | 200 MHz | CL3 | ||||
-6/-6I | 166 MHz | CL2.5 | ||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life, N=Not recommended for new design. | ||||||
Part No. | Density | Organization | Speed Grade | |||
W9712G6JB | 256Mb DDR | 8Mx16 | 4 Banks | -18 | DDR2-1066 | 2007/7/7 |
-25/ 25I/25A | DDR2-800 | 5-5-5/6-6-6 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
W9712G8JB | 256Mb DDR | 16Mx8 | 4 Banks | -18 | DDR2-1066 | 2007/7/7 |
-25 | DDR2-800 | 5-5-5/6-6-6 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. | ||||||
Part No. | Density | Organization | Speed Grade | |||
W9712G6JB | 128Mb DDR2 | 8Mx16 | 4 Banks | -18 | DDR2-1066 | 2007/7/7 |
-25/ 25I/25A | DDR2-800 | 5-5-5/6-6-6 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
W9712G8JB | 128Mb DDR2 | 16Mx8 | 4 Banks | -18 | DDR2-1066 | 2007/7/7 |
-25 | DDR2-800 | 5-5-5/6-6-6 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. | ||||||
Part No. | Density | Organization | Speed Grade | CL-tRCD-tRP? | ||
W9725G6JB | 256Mb DDR2 | 16Mx16 | 4 Banks | -18 | DDR2-1066 | 2007/7/7 |
-25/ 25I/25A | DDR2-800 | 5-5-5/6-6-6 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
W9725G8JB | 256Mb DDR2 | 32Mx8 | 4 Banks | -18 | DDR2-1066 | 2007/7/7 |
-25/ 25I | DDR2-800 | 5-5-5/6-6-6 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. | ||||||
Part No. | Density | Organization | Speed Grade | CL-tRCD-tRP? | ||
W9751G6JB | 512Mb DDR2 | 32Mx16 | 4 Banks | -18 | DDR2-1066 | 2007/7/7 |
-25/25I | DDR2-800 | 5-5-5/6-6-6 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
W9751G8JB | 512Mb DDR2 | 64Mx8 | 4 Banks | -18 | DDR2-1066 | 2007/7/7 |
-25/25I | DDR2-800 | 5-5-5/6-6-6 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. | ||||||
Part No. | Density | Organization | Speed Grade | CL-tRCD-tRP? | ||
W971GG6JB | 1G DDR2 | 64Mx16 | 8 Banks | -18 | DDR2-1066 | 2006/6/6 |
-25/25I | DDR2-800 | 2005/5/5 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
W971GG8JB | 1G DDR2 | 128Mx8 | 8 Banks | -18 | DDR2-1066 | 2006/6/6 |
-25/25I | DDR2-800 | 2005/5/5 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. | ||||||
Part No. | Density | Organization | Speed Grade | CL-tRCD-tRP? | ||
W972GG6JB | 2G DDR2 | 128Mx16 | 8 Banks | -18 | DDR2-1066 | 2007/7/7 |
-25/25I | DDR2-800 | 5-5-5/6-6-6 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
W972GG8JB | 2G DDR2 | 256Mx8 | 8 Banks | -18 | DDR2-1066 | 2007/7/7 |
-25/25I | DDR2-800 | 5-5-5/6-6-6 | ||||
-3 | DDR2-667 | 2005/5/5 | ||||
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. |
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