深圳英集芯科技股份有限公司,于2022年4月19日正式登陆上交所科创板,股票简称:英集芯;股票代码:688209。公司成立于2014年11月20日,是一家专注于高性能、高品质数模混合芯片设计公司,主营业务为电源管理芯片、快充协议芯片的研发和销售。英集芯持续推出高性价比的智能数模混合芯片,提供的电源管理芯片和快充协议芯片广泛应用于移动电源、快充电源适配器、无线充电器、车载充电器、TWS耳机充电仓等产品。公司合作的最终品牌客户包括小米、OPPO等知名厂商。
英集芯的芯片产品具备高集成度、高可定制化程度、高性价比、低可替代性的特点,能够缩短客户成品方案研发周期,简化客户产品生产过程,提升产品良率和可靠性,从而帮助客户优化成本并满足多样化的需求。
未来,英集芯将基于在消费电子领域的优势市场地位,以行业前沿技术和客户需求为导向,发挥自身在电源管理芯片和快充协议芯片领域的研发及设计优势,持续推出具有市场竞争力的芯片及配套解决方案,进一步提升产品的品牌知名度,不断拓展应用领域及下游客户覆盖范围,致力于成为国际一流的数模混合芯片设计公司。
Injoinic Technology Corp. was officially listed on the Science and Technology Innovation Board of Shanghai Stock Exchange on April 19, 2022. Stock code: 688209. The company was founded on November 20, 2014. It is a design company focusing on high performance and high quality digital-analog hybrid chips. The main business is R&D and sales of power management chips and fast charge protocol chips. Besides, INJOINIC continues to launch cost-effective intelligent digital-analog hybrid chips, and their power management chips and fast charging protocol chips that are widely used in mobile power supplies, fast charging source adapters, wireless chargers, car chargers, TWS headset charging bin and other products. The final brand customers of the company include xiaomi, OPPO and other well-known manufacturers.
With the characteristics of high integration, high customizability, high cost performance and low substitutability, INJOINIC chip products can shorten the R&D cycle of finished product solutions, simplify the production process, improve product yield and reliability, so as to help customers optimize costs and meet diverse needs.
In the future, INJOINIC will be based on the set core advantages in the field of consumer electronics market position, with industry cutting-edge technology and customer demand as the guidance, exert its protocol chip is filled in the power management chip and fast in the field of research and development and design advantages, continue to launch with the market competitiveness of chips and form a complete set of solutions, further enhance the brand awareness of the product, Continue to expand the scope of application and downstream customer coverage, is committed to becoming the world's first-class digital and analog hybrid chip design company.
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